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QES Mechatronic Sdn. Bhd. - DIS8000


DIS8000 is designed to handle frame wafers post wafer dicing process. It is able to inspect defects that are observable prior to dicing and also die defects resulted post dicing process.

It’s equipped with two types of defect identification methods, inking on the defective die and wafer map containing locations of the defective die with classification. The system is capable of Performing wafer backside inspection.

- Designed for 8" & 12" wafer mounted on dicing frame.

- Programmable framed wafer magazine loader.

- Grip & Push handling mechanism for framed wafer.

- Barcode reader for wafer map retrieval from host.

- Point-and-shoot wafer alignment method.

- Micro-optics with bright-field, dark-field and normaski interference contract illuminations.

- Motorized objective lens ranging from 5x to 100x objectives.

- Die inking reject identification module with wafer map.

- Optional back side inspection module.

- Optional SECS/GEM communication module.

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