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AEHR Test Systems - FOX-XP Multi Wafer & Singulated Die / Module Test System


High Throughput Reliability Verification and Test System for Volume Production

Handles full wafers / panels / singulated die / modules for highest production throughput
Identifies failing logic / memory / photonic die before final package integration
High power system with up to 18 Blades (slots) for wafer or panel testing using WaferPakTM
contactors or 9 Blade capability for singulated die / module DiePak® carriers

Configurable Channel Resources

Multiple resource modules available per Blade (slot): Universal Channel Modules, High Voltage
Channel Modules or High Current Channel Modules
Up to 2,048 “Universal Channel” resources: (I/O / Clock / PPMU / DPS) per Blade with deep scan, pattern data and capture memory per channel for test of devices with BIST/DFT
Up to 1,024 high voltage (29V) or high current (2A) sources resources per Blade

Production Proven Full-Wafer Reliability Verification & Test Solution

Reduces test costs by functionally testing wafers / die / modules during reliability verification
Offers a total solution when configured with a WaferPak contactor / DiePak carrier and Wafer Aligner / DiePak Loader
Protects devices with individual per channel over-current and over-voltage protection

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