Assembly & Final Test
After the wafer is singulated, each die can be placed and attached (bonded) to a suitable package, e.g. leadframe.
Next steps are wire bond, encapsulation and finishing, lead trimming, package marking, funcinality final package test for electric performance and package burn in for assure reliability.
Next steps are wire bond, encapsulation and finishing, lead trimming, package marking, funcinality final package test for electric performance and package burn in for assure reliability.
