The Nordson TEST & INSPECTION's Bondtest 4800 INTEGRA® is a complete solution for automated semiconductor wafer bond testing. INTEGRA is designed for maximum throughput in an operator free environment. It is our most advanced quality control tool.

Wafer Handler Integration:

Integration with a wafer handler transforms the 4800 INTEGRA into a fully automated system ensuring reliable and repeatable operation, utilizing the latest generation of bond testing software, Paragon™. The highly intuitive and configurable interface provides quick and easy automated test routine development and execution for a wide range of sample configurations. A step by step wizard guides the user through the set up process, catering for a variety of options. Paragon™ also provides the ability to simultaneously display and record the view from multiple cameras

Successfully Test Warped and Thin Wafers:

The edge lift smart chuck has a unique design where the edge lift pins ensure that warped or thin wafers cannot slide off the chuck. The gradual vacuum pressure enables optimum vacuum on the wafer.

Features include:
Pre-alignment Accuracy
Lateral movement is eliminated by fully supporting the wafer at the edges. This assures secure wafer placement for every application

Test Warped Wafers and Panels:

Automatic wafer justification combined with our patented Lipseal™ technology ensures that even very warped wafers can be tested accurately. We have capabilities to automatically justify semiconductor wafers or panels with +10mm of warpage.

Intelligent and Intuitive Chuck Controller:

The multi-function programmable controller ensures safe and secure transfer of the wafer. Seamlessly integrated into the Paragon software it provides feedback on the vacuum clamping pressures therefore preventing damage to the wafer. What’s more the operator can easily see continuous feedback of the vacuum and air levels and can therefore take action to prevent damage to the wafer should there be an interruption to the air supply

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