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Nisene - JetEtch Pro


The Industry-Leading Decapsulation System.

Nisene Technology Group has yet again raised the bar with its latest automated decapsulation system. Much like our JetEtch decapsulation system, the safety and performance features of the JetEtch Pro decapsulation system are unparalleled in the industry.

The JetEtch decapsulation system takes an integrated circuit encapsulated in mold compound and removes it using a user-specified chemical solution. The process of mold compound removal is called “decapsulation” and is often referred-to as “decapping,” “Jet-Etching,” and similar. The results of this process can be used in a number of ways, but are most commonly seen in semiconductor failure analysis and counterfeit protection during the verification process. Without exposing the die in an integrated circuit, verifying a part’s authenticity is virtually impossible. Die exposure is also critical to the failure analysis industry, as a die in this state lends itself best to a wide number of types of tests.


For more information about Nisene's JetEtch Pro please click here

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