- Trim Form Singulation System

Application device : All types of lead package
QFN (MLP), QFP, DIP, SOIC, SOT, TO, TSOP, TSSOP, PBGA, PLCC, etc.
Trim system SPM : 200 Form system SPM : 120
M/Z or Cassette to Tray or Tube
Full auto system
PLC / PC available
Cam location : bottom
Tool up : link (cylinder)
Feeding : syncronized index
QFN (MLP), QFP, DIP, SOIC, SOT, TO, TSOP, TSSOP, PBGA, PLCC, etc.
Trim system SPM : 200 Form system SPM : 120
M/Z or Cassette to Tray or Tube
Full auto system
PLC / PC available
Cam location : bottom
Tool up : link (cylinder)
Feeding : syncronized index
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