QES Mechatronic Sdn. Bhd. - ISP3100

ISP3100 is designed to handle lead frames or substrates for visual inspection and yield management
after die attach and wire bonding process. It’s equipped with strip mapping system and auto-conversion for different types of packages. It’s capable to perform physical marking with various types of reject identication module such as puncher, wire breaker, bristle, scriber and inker.

- Designed to handle leadframe or substrate size of max. 300x100mm

- Auto-conversion module for leadframe package changeover without manual adjustment.

- Pusher & Gripper with anti-jamming mechanism.

- Pneumatic clamps to hold leadframe into position during stage movement.

- Programmable center support rail for warped leadframe.

- User friendly HMI with strip mapping control.

- Various reject marking module for selection. (inker, scriber, bristle, puncher, wire breaker, laser
cutter and etc.)

- Optional SECS/GEM communication module.