10nm advanced deposition capability

Spot, Ring, and Arc pattern deposits anywhere on wafer with controllable width

Full wafer (blanket) deposits with high spatial uniformity

Cluster-free deposition of PSL spheres and SiO2 spheres

Highly accurate control of deposited particle peak diameter

Control of deposited particle size distribution width

Accurate control of deposited particle count

Fully-automated recipe-based deposition control

Deposition of up to 16 different particle suspensions with one recipe

Automated measurement and detailed analysis of particle suspension size distributions

Standard manually-loaded version supports 150mm, 200mm, 300mm wafers

Optional automated version supports automatic loading of 200mm and 300mm wafers

Deposition and Suspension Analysis report generation and exporting

Produce countless particle wafer standards in house at lower cost than standards provided by an outside supplier

Minimize turn-around time of particle depositions

Protect valuable intellectual property by depositing particles on proprietary films in house

Minimize risk of contamination by producing particle wafer standards in house

Increase device fabrication process yield with properly calibrated inspection tools and optimized substrate cleaning processes

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