What is SpinSAM?

Spin Scanning Acoustic Microscopy

The SpinSAM automated inspection tool delivers high throughput and better sensitivity for accurately locating defects in wafer based assemblies. Ideal applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more. Efficiently spin scan up to 4 wafers simultaneously with 4 matched transducers, wafers can be inspected over the widest frequency range ever achieved in a production environment. Waterfall transducer provides non-immersion scanning which minimizes risks of contamination and false bond indications.

Highlights:

- Industry leading throughput on four 300mm wafer inspection
- Best in class footprint / UPH
- Leading defect capture and image quality
- Modular design for ease of serviceability
- Fully automated inspection and analysis with factory communication

Every Second Counts:

With SpinSAM, downtime becomes a thing of the past
Ensure continuous operation and peak performance
SpinSAM’s modular design allows for efficient Mean Time to Repair (MTTR)
Any necessary repairs can be swiftly addressed, keeping your production line running smoothly without extended interruptions

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