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international Test Solutions - Probe Lap


Probe Lap™ is a precision lapping film developed specifically for probe card cleaning during room temperature and “hot chuck” wafer level test applications up to +125oC. Probe Lap™ is applicable for all probe needle materials (i.e., tungsten, rhenium tungsten, beryllium copper, and palladium–alloy) and can be used as a direct replacement for the “pink” and/or "yellow-green" lapping films used by many sort floors to abrasively clean probe tips . A proprietary manufacturing process is used to fabricate Probe Lap™ with 1 or 3-micron grit particle sizes (aluminum oxide or silicon carbide) and attain a uniform surface morphology that provides consistent material removal as well as reduced debris generation.

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