Wafer Prober & Test
Each chip on the wafer is electrical tested and characteriest.
Probe card, wafer prober, tester, wafer level burn in tester are used for this process step. Tests are done in temperature from -55°C to +175°C.
After probe the circuit chips on the wafers are seperated with precision diamond saws.
Probe card, wafer prober, tester, wafer level burn in tester are used for this process step. Tests are done in temperature from -55°C to +175°C.
After probe the circuit chips on the wafers are seperated with precision diamond saws.
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