Entegris - Chuck Cleaning Wafer (CCW)
Maximizes tool uptime and operational efficiency by removing defects and reducing downtime.
The CCW is an ultra-pure silicon wafer with flat polymer coating designed to clean wafer chucks of advanced semiconductor capital equipment. Standard CCWs are available in 200 and 300 mm sizes. Smaller diameter wafers or specialty formats are available upon request.
- Enables tool chuck cleaning without having to open the process chamber
- Reduces unplanned downtime caused by contamination
- Allows chambers to be back in production within minutes
- Increases yield and extends performance lifetime
Chuck Cleaning Wafer (CCW) Applications:
ESC (Electrostatic chuck) applications:
1) Dry Etch Application:
The CCW removes particles and process debris from the ESC that can cause helium backside leaks. This can be done without opening the process chamber for a wet clean, reducing downtime from > 8 hours to a few minutes.
2) PVD Application:
The CCW removes particles and process debris from the ESC that can cause backside pressure faults. This can be done without opening the process chamber, reducing downtime for cleaning from > 12 hours to a few minutes.
Vacuum chuck applications:
1) Lithography Application
The CCW removes particles and process debris that cause focus faults on the vacuum chuck. This can be done without opening the tool, reducing downtime from > 1 hour to a few minutes.
2) Prober Chuck and Metrology Applications (Wafer Test)
The CCW removes particles and process debris on the prober chuck that can damage or contaminate product wafers. This can be done without opening the tool, reducing downtime especially for high- or low-temperature testing.
The CCW is an ultra-pure silicon wafer with flat polymer coating designed to clean wafer chucks of advanced semiconductor capital equipment. Standard CCWs are available in 200 and 300 mm sizes. Smaller diameter wafers or specialty formats are available upon request.
- Enables tool chuck cleaning without having to open the process chamber
- Reduces unplanned downtime caused by contamination
- Allows chambers to be back in production within minutes
- Increases yield and extends performance lifetime
Chuck Cleaning Wafer (CCW) Applications:
ESC (Electrostatic chuck) applications:
1) Dry Etch Application:
The CCW removes particles and process debris from the ESC that can cause helium backside leaks. This can be done without opening the process chamber for a wet clean, reducing downtime from > 8 hours to a few minutes.
2) PVD Application:
The CCW removes particles and process debris from the ESC that can cause backside pressure faults. This can be done without opening the process chamber, reducing downtime for cleaning from > 12 hours to a few minutes.
Vacuum chuck applications:
1) Lithography Application
The CCW removes particles and process debris that cause focus faults on the vacuum chuck. This can be done without opening the tool, reducing downtime from > 1 hour to a few minutes.
2) Prober Chuck and Metrology Applications (Wafer Test)
The CCW removes particles and process debris on the prober chuck that can damage or contaminate product wafers. This can be done without opening the tool, reducing downtime especially for high- or low-temperature testing.
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