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Home | Semiconductor Production | ITS - Mipox LC8K

ITS - Mipox LC8K


Mipox LC8K
ITS

www.inttest.net
The presence of chlorine ions and chloride contamination on a bond pad surface can act as a catalyst for the copper (Cu) corrosion process and dramatically weaken the copper-aluminum (Cu-Al) intermetallic compounds (IMC). Reduced bond integrity can create long-term reliability issues for packaged devices.

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